The flagship phone battle in China is almost settled for this year. What comes next is a wave of sub-flagship models to be powered by the up-and-coming chips from Qualcomm and MediaTek.

Qualcomm is set to unveil the Snapdragon 8 Gen 5 later this year, and phones powered by it will start showing up soon after. A new leak has now given us a tentative timeframe for the launch of MediaTek’s counterpart.

MediaTek is reportedly working on two smartphone chips: the Dimensity 8500 and Dimensity 9500e. And according to tipster Digital Chat Station, the first phones powered by these chips will not launch until January next year. These phones are also said to have flagship-level specifications and large batteries.

What we know so far

As you might have guessed, the Dimensity 9500e is the powerful of the two, running at up to 3.73GHz. It reportedly uses a CPU setup of 1× Cortex-X925, 3× Cortex-X4, and 4× Cortex-A720 cores.

The GPU is said to be an Arm G925 MP12 clocked at 1612MHz, and the chip is built on TSMC’s advanced 3nm N3E process.

Meanwhile, the Dimensity 8500 is designed for slightly affordable phones but still carries a punch. It’s reportedly based on TSMC’s 4nm process and uses an 8-core setup built around ARM’s A725 architecture — meaning all cores are “big” cores.

The prime core is said to reach 3.4GHz, a small but notable bump from the 3.25GHz seen in its predecessor, the Dimensity 8400. Graphics performance could also get a lift thanks to a Mali-G720 GPU tuned to around 1.5GHz. The Dimensity 8500 reportedly scores around 2.2 million points on AnTuTu.

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(Source)